Sensl

This GSTP Element 2 activity saw the successful development of a large area TSV packaged SiPM which was subjected to a full set of characterisation, qualification and reliability assessment testing. Through this program we were able to develop a large area process technology required to package SiPM in a manner which allows them to be tiled with minimal dead space between sensors. This work has successfully lead to the development of a new product, the MicroFJ-60035-TSV.