Hybrids and Packaging of Components

What is the Hybrids and Packaging Components domain?

The Hybrids and Packaging domain cover all types of EEE components, addressing the construction and performance of devices used for satellite electronics applications.

Essentially, “Packaging” addresses the mounting, interconnection, encapsulation, and reliability of semi-conductor devices.

Included within the perimeter are:-

• Hermetic hybrids – generally complex multi-chip devices, with a ceramic substrate, enclosed in an hermetically sealed package.
• Non-Hermetic packages – devices that may be complex with a variety of substrate materials and types, that include semiconductor devices but are not sealed within hermetic cavities.
• Discreet device packaging of Silicon, Gallium arsenide and Gallium Nitride.
• Assembly of devices using Chip on Board technologies.

All aspects and considerations for qualification, storage, and conditioning, as well as materials and processes used in EEE are also within the perimeter of the Hybrids and Packaging domain.  

Why is Hybrids and Packaging Components important?

All satellites are dependent on reliable electronics to fly & achieve the mission functions and objectives. Without reliable electronics, the mission can fail to meet the objectives.

It is therefore essential that the components used in the systems on the spacecraft are of sufficient quality to survive the mechanical, electrical & environmental demands of service required for the mission.

Reliable and dependable packaging is essential as it serves the function of accommodating and connecting the functional elements (transistor, MMIC, ASIC, etc.) to the rest of the electronic assembly. Reliable packaging will depend on the right combination of materials and the highest quality in manufacturing processes.

Future packaging developments such as COTS, 2.5D & 3.0D devices & Non-hermetic products will offer cost and technological benefits. Understanding, developing and ensuring the reliability of these developments is of critical importance for future missions.